Switch Series & Supported Models
Browse common switch series and models supported for each brand.
US$37,999.00
| Part Number | MSN4600-VS2FC | Switch ASIC | NVIDIA Spectrum-3 |
|---|---|---|---|
| Form Factor | 2U | Switching Capacity | 12.8Tbps |
| Ports | 64 x QSFP56 | Port Speed | 200GE |
| Software | NVIDIA Cumulus Linux | Airflow | Power-to-Connector (P2C) |
| Cooling Mechanism | Air Cooled | Input Voltage | 100VAC / 110VAC, 15A; 120VAC, 12A; 200–240VAC, 10A, 50/60Hz |
| Dimensions (H × W × D) | 88 × 428 × 566.4mm | Warranty | 1-Year / 3-Year / 5-Year Support Options Available |
Browse common switch series and models supported for each brand.
Find answers to common questions about our products.
Yes. Each 200GbE QSFP56 port can break out into two independent 100GbE links without consuming adjacent port resources. This allows the platform to operate as 64×200GbE or scale to up to 128×100GbE connections, making it suitable for a gradual migration from 100GbE leaf networks to a 200GbE spine layer.
200GbE Ethernet typically uses PAM4 signaling, while traditional 100GbE QSFP28 links commonly use NRZ signaling.
Yes, but port planning is required. A 200GbE QSFP56 port can break out into 4×50GbE or 4×25GbE connections. However, each four-way breakout requires the adjacent physical QSFP56 port to be disabled. The system therefore supports up to 128 logical 50GbE or 25GbE interfaces, rather than 256 breakout connections across all 64 cages.
Yes. Cumulus Linux supports BGP EVPN as the control plane for VXLAN. When the switch operates only as a spine or route reflector and exchanges EVPN routes, it typically does not require local VXLAN tunnel interfaces.
Each QSFP56 port supports modules rated up to 5W. Before deploying high-density optics or active cables, verify the actual module power draw, system power headroom, and rack cooling capacity. This P2C model moves air from the power-supply side toward the connector side, so airflow direction should remain consistent with other equipment in the rack to reduce recirculation and thermal risk.
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